Abstract
There is a widely held belief that going all digital is the pathway to design modern RF transceivers. This talk challenges this very notion. This seminar shows that when it comes to implementation of ultra-high data rates in excess of 10 Gbps, going all way to 100 Gbps and above, the all-digital design faces some incredible challenges that are impossible to address in silicon technologies. The talk then presents the novel idea of realizing modulation and demodulation schemes directly in RF domain. Three transmitter/receiver chip prototypes are presented that utilize this idea to achieve extremely power-efficient 15+ Gbps data rates.
Biography
Payam Heydari (M’01, SM’09, F17) received his B.S. and M.S. degrees (Honors) in Electrical Engineering from Sharif University of Technology in 1992 and 1995, respectively. He received his Ph.D. degree from the University of Southern California in 2001. He is currently a Full Professor of Electrical Engineering at the University of California, Irvine. Dr. Heydari’s research covers the design of terahertz/millimeter-wave/RF and analog integrated circuits. He is the (co)-author of two books, one book chapter, and more than 150 journal and conference papers. He has given Keynote Speech to IEEE GlobalSIP 2013 Symposium on Millimeter Wave Imaging and Communications, served as Invited Distinguished Speaker to the 2014 IEEE Midwest Symp. on Circuits and Systems, and gave a Tutorial at the 2017 International Solid-State Circuits Conference (ISSCC). He was a Distinguished Lecturer of the IEEE Solid-State Circuits Society (Jan. 2014 – Jan. 2016), and is now a Distinguished Microwave Lecturer of the IEEE Microwave Theory and Techniques Society (Jan. 2019 – Dec. 2022). His group was among the first who introduced the design of millimeter-wave integrated circuits in silicon technologies. They demonstrated the world’s first fundamental frequency CMOS transceiver operating above 200 GHz, the world’s highest radiated power and highest efficiency sub-terahertz circularly-polarized radiator in silicon employing a multi-port cavity-backed structure.
Dr. Heydari is the recipient of the 2016-2017 UCI’s School of Engineering Mid-Career Excellence in Research, the 2014 Distinguished Engineering Educator Award from Orange County Engineering Council, the 2009 Business Plan Competition First Place Prize Award and Best Concept Paper Award both from Paul Merage School of Business at UC-Irvine, the 2010 Faculty of the Year Award from UC-Irvine’s Engineering Student Council (ECS), the 2009 School of Engineering Best Faculty Research Award, the 2007 IEEE Circuits and Systems Society Guillemin-Cauer Award, the 2005 IEEE Circuits and Systems Society Darlington Award, the 2005 National Science Foundation (NSF) CAREER Award, the 2005 Henry Samueli School of Engineering Teaching Excellence Award, and the Best Paper Award at the 2000 IEEE Int’l Conference on Computer Design (ICCD). He was recognized as the 2004 Outstanding Faculty in the EECS Department of the University of California, Irvine. His research on novel low-power multi-purpose multi-antenna RF front-ends received the Low-Power Design Contest Award at the 2008 IEEE Int’l Symposium on Low-Power Electronics and Design (ISLPED).
Dr. Heydari is an AdCom member of the IEEE Solid-State Circuits Society. Dr. Heydari currently serves He currently serves both as an Associate Editor and a Guest Editor for the IEEE Journal of Solid-State Circuits and an Associate Editor for the IEEE Solid-State Circuit Letters. He was an Associate Editor of the IEEE Transactions on Circuits and Systems. He was a member of Technical Program Committee of the International Solid-State Circuits Conference (ISSCC). He is the director of the Nanoscale Communication IC (NCIC) Labs.